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Special materials
No doubt that the semiconductor market is quickly changing
through continuous development (summarized in Moore’s law).
Your problems are challenges for our R&D team. With our
experience and long history we can help you move forward with
your developments. Product developments have proven to be
the most successful when organized in projects with our
customers. The latest process developments resulted in two
new materials: T-SiC and C-SiC.
T-SiC Parts are formed by a thick CVD SiC
coating process on a machined carbon form (product negative).
Removing the carbon leaves a pure thick SiC final product, with
exceptional clean bulk purity. Product configurations vary from
small pins up to big plates. Product details and surface finish
can be machined to customer demands. A Schunk patented
XClean process leaves an ultra high surface purity.
C-SiC Parts are preformed in carbon fiber
reinforced carbon of high purity. Through impregnation with
molten silicon the material is converted into SiC. Not all of the
carbon reacts with the silicon, resulting in a composite
structure. This C-SiC material is mechanically strong, has a
high thermal shock resistance and a high purity.
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